Printed circuit board before being formed and cut and manufacturing method thereof

• Main Authors: ZHANG LIREN, WANG FUREN, QIU ZONGWEI, HUANG ZHENYI, YANG DALONG, ZHOU ZHICHANG
• Format: Patent
• Language: Chinese; English
• Published: 23.11.2011
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

The invention provides a printed circuit board before being formed and cut and a manufacturing method thereof. The circuit board comprises: a circuit board with a complete external-layer circuit, wherein the circuit board exposes a circuit connecting part; a plurality of connecting gold fingers which are connected with the circuit connecting part and provided with a main part and a protruding part; and a forming route which extends along the edge of the circuit board of the protruding part, wherein a certain distance of over 0.0508 mm. is reserved between the forming route and the protruding part. Because of a certain distance reserved between the forming route and the protruding part, the problem of the connecting finger stripping caused during forming and cutting is solved.