METHOD FOR STACKING DEVICES

A method for fabricating a semiconductor device is provided which includes providing a first device, a second device, and a third device, providing a first coating material between the first device and the second device, the first coating material being uncured, providing a second coating material b...

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Bibliographic Details
Main Author WANG DEAN [TW]; LEE CHIEN-HSIUN [TW]; CHEN CHEN-SHIEN [TW]; CHAO CLINTON [TW]; L
Format Patent
LanguageChinese
English
Published 30.12.2009
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A method for fabricating a semiconductor device is provided which includes providing a first device, a second device, and a third device, providing a first coating material between the first device and the second device, the first coating material being uncured, providing a second coating material between the second device and the third device, the second coating material being uncured, and thereafter, curing the first and second coating materials in a same process.
Bibliography:Application Number: CN200910150015