Resin for resin film infiltration process and preparation method thereof

The invention discloses a resin for a resin film infiltration process and a preparation method thereof. The preparation method comprises the following steps: performing prepolymerization on 100 weight portions of bismaleimide resin and 50 to 90 weight portions of diallyl allyl phenyl compound at a t...

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Bibliographic Details
Main Authors YUAN LI, GUAN QINGBAO, GU AIJUAN, LIANG GUOZHENG
Format Patent
LanguageChinese
English
Published 30.12.2009
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Summary:The invention discloses a resin for a resin film infiltration process and a preparation method thereof. The preparation method comprises the following steps: performing prepolymerization on 100 weight portions of bismaleimide resin and 50 to 90 weight portions of diallyl allyl phenyl compound at a temperature of between 120 and 140 DEG C for 30 to 60 minutes to obtain a prepolymer; adding 20 to 300 weight portions of cyanate ester resin after the temperature of the prepolymer is reduced to be between 100 and 120 DEG C; prepolymerizing the mixture at a temperature of between 100 and 120 DEG C for 30 to 60 minutes to obtain bismaleimide-triazine (BT) resin; adding 10 to 50 weight portions of hyperbranched polyorganosiloxane into the BT resin to react at a temperature of between 80 and 100 DEG C for 20 to 200 minutes, and cooling the reacted products to form a film and obtaining a resin film (sheet) for the resin film infiltration process. A composite prepared from the film sheet has excellent comprehensive mech
Bibliography:Application Number: CN20091181349