Method for three-dimensionally capturing and rotating micromechanical member by using ultrasonic radiation force

• Main Authors: CHEN ZICHEN, FAN ZONGWEI, YANG KEJI, MEI DEQING
• Format: Patent
• Language: Chinese; English
• Published: 16.12.2009
• Subjects: MICROSTRUCTURAL TECHNOLOGY; PERFORMING OPERATIONS; PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS; TRANSPORTING

The invention discloses a method for three-dimensionally capturing and rotating a micromechanical member by using an ultrasonic radiation force. In the method, four ultrasonic transducers are used to generate a wave beam having a spiral wave front, the wave beam interferes and is superposed with a radiation wave beam generated by an ultrasonic transducer which is coaxial with and opposite to the four ultrasonic transducers, an interferential sound field has the capacity for three-dimensionally capturing the micromechanical member, and the direction angle of an ultrasonic radiation force potential trough along the circumferential direction of an ultrasonic transducer phase is adjusted and changed to drive the micromechanical member to rotate around an axis. Compared with the conventional operation policy, the method has an important function of angle control and can control the rotation direction and angle of the micromechanical member. The method plays a significant role on occasions when non-contact operatio