Novel pre-treatment process for liberation of metals from waste printed circuit boards using organic solution

• Main Authors: JHA MANIS KUMAR, JEONG JIN KI, YOO JAE MIN, LEE JAE CHUN
• Format: Patent
• Language: Chinese; English
• Published: 09.12.2009
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION ORPROCESSING OF GOODS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; FERROUS OR NON-FERROUS ALLOYS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; PRETREATMENT OF RAW MATERIALS; PRINTED CIRCUITS; PRODUCTION AND REFINING OF METALS; SEMICONDUCTOR DEVICES; TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION; TECHNICAL SUBJECTS COVERED BY FORMER USPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS; TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINSTCLIMATE CHANGE; TREATMENT OF ALLOYS OR NON-FERROUS METALS

The present invention relates to a method for recovering valuable metals contained in printed circuit boards of waste electronic machine, and more particularly, to a method for recovering valuable metals from waste printed circuit boards by separating several plastic layers laminated using an organic solution and then separating plastic components from metal components using an electrostatic separation process. According to the present invention, it is possible to separate the non-metal containing the plastic components and the metal components from the waste printed circuit boards by separating the several plastic layers laminated via simple pre-process using an organic solvent and obtain the metal recovery ratio of 99.99% via the pre-process and an electrostatic separation process.