Vacuum encapsulation technology for transformer

• Main Authors: SHAN YING, WANG GUIYING, HE XIANGLIN, XU QIONGMEI
• Format: Patent
• Language: Chinese; English
• Published: 28.10.2009
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRICITY; INDUCTANCES; MAGNETS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES; TRANSFORMERS

The invention relates to a vacuum encapsulation technology for a transformer, which comprises the following steps: 1. an epoxy adhesive of A component and a device to be encapsulated are preheated in an oven for 2h to 4h, with the temperature of the oven set as 80 DEG C to 100 DEG C; 2. the epoxy adhesive of A component, which can be stirred after being preheated, is stirred; 3. after being stirred, the epoxy adhesive of A component is matched with an epoxy adhesive of B component according to a certain proportion, then mixed together and stirred fully; 4. the preheated device is taken out and the matched epoxy adhesives are poured into the shell of the device so as to lead the surface of the adhesives to reach the height of a wire wrap; 5. the device is put into a vacuum pump and vacuumized for 10 minutes; 6. the device is taken out and dried in the oven; 7. 2 hours later, the oven is opened to check whether the elasticity of the adhesive surface of the device is in a wiredrawing state; if so, a secondary en