Photo-setting adhesive for press key bonding injection moulding
The invention discloses a photocuring adhesive for key-press splicing and injection molding. The photocuring adhesive comprises the following compositions in percentage by weight: 30 to 80 percent of organosilicon acrylate, 5 to 30 percent of acrylate oligomer, 2 to 30 percent of acrylate monomer, 0...
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Main Authors | , , , , |
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Format | Patent |
Language | Chinese English |
Published |
08.07.2009
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Subjects | |
Online Access | Get full text |
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Summary: | The invention discloses a photocuring adhesive for key-press splicing and injection molding. The photocuring adhesive comprises the following compositions in percentage by weight: 30 to 80 percent of organosilicon acrylate, 5 to 30 percent of acrylate oligomer, 2 to 30 percent of acrylate monomer, 0.1 to 10 percent of light evocating agent, 0.1 to 10 percent of aerosil, 0.1 to 10 percent of coupling agent and 0.1 to 5 percent of additive. The invention also discloses a method for preparing the photocuring adhesive for key-press splicing and injection molding, application of the adhesive to a key-press part and a simple injection molding process. The photocuring adhesive has good splicing property, elasticity, solvent resistance, and excellent electrical performance and weather resistance; and a product has good maneuverability such as levelling, defoaming, easy demoulding, and the like in injection molding. |
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Bibliography: | Application Number: CN2009136434 |