Photo-setting adhesive for press key bonding injection moulding

The invention discloses a photocuring adhesive for key-press splicing and injection molding. The photocuring adhesive comprises the following compositions in percentage by weight: 30 to 80 percent of organosilicon acrylate, 5 to 30 percent of acrylate oligomer, 2 to 30 percent of acrylate monomer, 0...

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Bibliographic Details
Main Authors TAI NANSHENG, WU GUOFEI, QIU YONGZHEN, HUANG ZHANGUANG, LIU ZHAOHUI
Format Patent
LanguageChinese
English
Published 08.07.2009
Subjects
ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE
ADHESIVES
CHEMISTRY
DYES
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL
PAINTS
POLISHES
USE OF MATERIALS AS ADHESIVES
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Summary:The invention discloses a photocuring adhesive for key-press splicing and injection molding. The photocuring adhesive comprises the following compositions in percentage by weight: 30 to 80 percent of organosilicon acrylate, 5 to 30 percent of acrylate oligomer, 2 to 30 percent of acrylate monomer, 0.1 to 10 percent of light evocating agent, 0.1 to 10 percent of aerosil, 0.1 to 10 percent of coupling agent and 0.1 to 5 percent of additive. The invention also discloses a method for preparing the photocuring adhesive for key-press splicing and injection molding, application of the adhesive to a key-press part and a simple injection molding process. The photocuring adhesive has good splicing property, elasticity, solvent resistance, and excellent electrical performance and weather resistance; and a product has good maneuverability such as levelling, defoaming, easy demoulding, and the like in injection molding.
Bibliography:Application Number: CN2009136434