Production method of multilayer printed wiring board and multilayer printed wiring board

• Main Authors: HAYASHI EIICHI, OHASHI SEIICHIRO, YAZAWA TAKAAKI, NAKAMURA SHIGEO, NAKAMURA JUNICHI
• Format: Patent
• Language: Chinese; English
• Published: 27.05.2009
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

Multilayer printed wiring boards may be prepared by forming a via hole by laser irradiation in insulating layer formed by a prepreg, comprised of a glass cloth impregnated with a thermosetting resin composition, and subjecting the via hole to a glass etching treatment with a glass etching solution a...