Production method of multilayer printed wiring board and multilayer printed wiring board
Multilayer printed wiring boards may be prepared by forming a via hole by laser irradiation in insulating layer formed by a prepreg, comprised of a glass cloth impregnated with a thermosetting resin composition, and subjecting the via hole to a glass etching treatment with a glass etching solution a...
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Main Authors | , , , , |
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Format | Patent |
Language | Chinese English |
Published |
27.05.2009
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Subjects | |
Online Access | Get full text |
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Summary: | Multilayer printed wiring boards may be prepared by forming a via hole by laser irradiation in insulating layer formed by a prepreg, comprised of a glass cloth impregnated with a thermosetting resin composition, and subjecting the via hole to a glass etching treatment with a glass etching solution and then to a desmear treatment with an oxidizing agent solution. By such a process, etch back phenomenon and excessive protrusion of glass cloth from the wall surface of a via hole can be sufficiently suppressed, and a highly reliable via can be formed. Particularly, a highly reliable via can be formed in a small via hole having a top diameter of 75 mum or below. |
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Bibliography: | Application Number: CN200810181503 |