Transfer printing membrane for forming metal pattern and method for forming metal pattern
The present invention provides a transfer film for forming metal pattern, which is obtained through stacking a resist layer, a metal layer with thickness of 1-20 mu m and a glass slurry layer sequentially on a supporting film. Furthermore the glass slurry layer comprises glass powder and adhesive re...
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Main Authors | , , , |
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Format | Patent |
Language | Chinese English |
Published |
06.05.2009
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Subjects | |
Online Access | Get full text |
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Summary: | The present invention provides a transfer film for forming metal pattern, which is obtained through stacking a resist layer, a metal layer with thickness of 1-20 mu m and a glass slurry layer sequentially on a supporting film. Furthermore the glass slurry layer comprises glass powder and adhesive resin, wherein the component element of adhesive resin which comes from polymer with hydrophilic radical is below 5by weight. The invention also provides a metal pattern forming method executed for forming the layers. The method for forming transfer film for forming metal pattern and metal pattern thereof can produce an electrode with low resistance. Furthermore the transparency of FPD component can be sustained and the stripping of metal foil from the glass slurry layer can be prevented in the developing procedure. Additionally the disengaging of resist layer from the metal foil can be prevented in the etching procedure. |
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Bibliography: | Application Number: CN200810172562 |