Wiring circuit board, manufacturing method for the wiring circuit board, and circuit module

• Main Authors: NAOTO MINARI, KAZUO IKENAGA, TAKASHI KATO, HIROSHI ODAIRA, TOMOO IIJIMA, KIMITAKA ENDO
• Format: Patent
• Language: Chinese; English
• Published: 12.10.2011
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH ISMODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THEDEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY,COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g.SWITCHING, GATING, MODULATING OR DEMODULATING; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; FREQUENCY-CHANGING; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; NON-LINEAR OPTICS; OPTICAL ANALOGUE/DIGITAL CONVERTERS; OPTICAL LOGIC ELEMENTS; OPTICS; PHYSICS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES; TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF

An object of the present invention is to reduce the number of steps necessary for connecting between a wiring circuit board and a printed circuit board and to achieve a low-cost wiring circuit board. A wiring circuit board (2) includes an insulating film (4), a bump (6), an etching barrier layer (8), and a wiring layer (10). The bump (6) is made of copper and formed to penetrate through the insulating film (4). A top face of the bump (6) is exposed at a surface of the insulating film (4) flush therewith. The etching barrier layer (8) is made of nickel (Ni) and formed underneath the bump (6). The bump (6) is connected to the wiring layer (10) through the etching barrier layer (8). A solder ball (12) is formed on the top face of the bump (6). A printed circuit board (14) as a rigid board isconnected to the wiring circuit board (2). A wiring layer (16) is connected to the bump (6) through the solder ball (12) to thereby mount the wiring circuit board (2) to the printed circuit board (14).