Novel reworkable underfills for ceramic MCM C4 protection

• Main Authors: OSTRANDER STEVEN P, POMPEO FRANK L, WU JIALI, COFFIN JEFFERY T
• Format: Patent
• Language: Chinese; English
• Published: 07.07.2010
• Subjects: BASIC ELECTRIC ELEMENTS; CHEMISTRY; COMPOSITIONS BASED THEREON; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; SEMICONDUCTOR DEVICES; THEIR PREPARATION OR CHEMICAL WORKING-UP

The present invention provides chip containing electronic devices such as Multichip Ceramic Modules (MCM's) (10) containing a plurality of chips (1 Ia-I Ii) on a substrate (15) which chips are underfilled with a reworkable composition (16) which allows one or more chips to be removed from the device and replaced. The reworkable compositions contain a base resin which is not cross-linkable and which forms a matrix with a linear curable component or preferably a combination of linear curable components which curable components are cross- linkable and when cured form a cross-linked domain in thebase resin matrix. A suitable cross-linking catalyst such as Pt is used and optionally a filler preferably silane surface treated silica. The preferred base resin is linear polydimethylsiloxane and the preferred curable components are vinyl terminated linear poly dimethyl siloxane and hydrogen terminated linear poly dimethyl siloxane.