Low melting point lead-free solder alloy

The invention discloses a lead-free solder alloy with a low melting point, which is composed of the following components: 53.0wt percent to 65.0wt percent of Bi, 0.02wt percent to 0.5wt percent of Cu, 0.01wt percent to 0.43wt percent of Ag, 0.01wt percent to 0.4wt percent of Ni, 0.001wt percent to 0...

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Bibliographic Details
Main Authors CAI ZHIHONG, ZHANG YUHANG, DAI XIANBIN, HAN ZHENFENG, ZHAO SIYONG
Format Patent
LanguageChinese
English
Published 25.03.2009
Subjects
ALLOYS
CHEMISTRY
FERROUS OR NON-FERROUS ALLOYS
METALLURGY
TREATMENT OF ALLOYS OR NON-FERROUS METALS
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Summary:The invention discloses a lead-free solder alloy with a low melting point, which is composed of the following components: 53.0wt percent to 65.0wt percent of Bi, 0.02wt percent to 0.5wt percent of Cu, 0.01wt percent to 0.43wt percent of Ag, 0.01wt percent to 0.4wt percent of Ni, 0.001wt percent to 0.6wt percent of RE, and Sn as the rest. The invention is the lead-free solder alloy of a low melting point that can improve brittleness, enhance tractility and plasticity, be easy to be manufactured into thread-solder and have high reliability of welding spots. The lead-free solder alloy with a low melting point is applied to the welding of heat sensitive components and parts and the step soldering of electronic components and parts.
Bibliography:Application Number: CN20081218780