Non-volatile memory device

A semiconductor device includes a plurality of nonvolatile memory cells ( 1 ). Each of the nonvolatile memory cells comprises a MOS type first transistor section ( 3 ) used for information storage, and a MOS type second transistor section ( 4 ) which selects the first transistor section. The second...

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Main Authors YAMAKI TAKASHI, FUJITO MASAMICHI, MATSUZAKI NOZOMU, KATAYAMA KOZO, HIRAKI MITSURU, TANAKA TOSHIHIRO, TANIKAWA HIROYUKI, SUZUKAWA KAZUFUMI, UMEMOTO YUKIKO, KAMIGAKI YOSHIAKI, SHINAGAWA YUTAKA, MINAMI SHINICHI
Format Patent
LanguageChinese
English
Published 25.02.2009
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Summary:A semiconductor device includes a plurality of nonvolatile memory cells ( 1 ). Each of the nonvolatile memory cells comprises a MOS type first transistor section ( 3 ) used for information storage, and a MOS type second transistor section ( 4 ) which selects the first transistor section. The second transistor section has a bit line electrode ( 16 ) connected to a bit line, and a control gate electrode ( 18 ) connected to a control gate control line. The first transistor section has a source line electrode ( 10 ) connected to a source line, a memory gate electrode ( 14 ) connected to a memory gate control line, and a charge storage region ( 11 ) disposed directly below the memory gate electrode. A gate withstand voltage of the second transistor section is lower than that of the first transistor section. Assuming that the thickness of a gate insulating film of the second transistor section is defined as tc and the thickness of a gate insulating film of the first transistor section is defined as tm, they have a
Bibliography:Application Number: CN200810166448