Electronic apparatus

• Main Author: TANAKA HIDEICHI
• Format: Patent
• Language: Chinese; English
• Published: 18.02.2009
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The invention provides an electronic device for preventing bad electric contact caused by thermal expansion. The electronic device includes: a semiconductor chip (10) on which an integrated circuit (12) is formed; an electrode (14) formed on the semiconductor chip (10) and electrically connected to the integrated circuit (12); a resin protrusion (18) disposed on the semiconductor chip (10); a wiring (20) formed on the electrode (14) and extending over the resin protrusion (18); a wiring board (30) on which a wiring pattern (32) is formed, the semiconductor chip (10) being mounted on the wiring board so that part of the wiring positioned over the resin protrusion (18) faces and is electrically connected to the wiring pattern (32); and an adhesive (42) that bonds the semiconductor chip (10) and the wiring board (30). The resin protrusion (18) is compressed in a direction in which the distance between the semiconductor chip (10) and the wiring board (30) decreases and is formed of a material having a negative co