Room curing and high temperature resistant silicone adhesives

The invention relates to an organic silica adhesive, in particular to a room temperature curing and high-temperature resistance organic silica adhesive which solves the problems that the adhesive in the prior art has low working temperature, complex curing process and poor adhesion performance. The...

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Bibliographic Details
Main Authors ZHANG ENTIAN, CHEN WEIJUN, LI GANG, SONG JUNJUN
Format Patent
LanguageChinese
English
Published 30.05.2012
Subjects
ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE
ADHESIVES
CHEMISTRY
DYES
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL
PAINTS
POLISHES
USE OF MATERIALS AS ADHESIVES
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Summary:The invention relates to an organic silica adhesive, in particular to a room temperature curing and high-temperature resistance organic silica adhesive which solves the problems that the adhesive in the prior art has low working temperature, complex curing process and poor adhesion performance. The organic silica adhesive comprises ladder-shaped organic silica glass resin solution, silica-contained curing accelerant, Cr2O3, gas phase method silica aerogel and asbestos clay. The working temperature and upper limit of the temperature resistance of the organic silica adhesive can reach 650 DEG C, furthermore, the shearing strength is more than 1.5MPa at the temperature of 650 DEG C; the thermal weight loss of the organic silica adhesive which is heated for 1 hour at the temperature of 650 DEG C is less than 5% and the thermal weight loss thereof at the temperature of 1000 DEG C for 1 hour is less than 10%; the adhesive has good adhesion performance and has no corrosion on the metal and inorganic heat-insulation
Bibliography:Application Number: CN20081137259