Circuit device and method for manufacturing circuit device

Disclosed are a circuit device wherein a wiring layer, an insulating resin and a circuit element are arranged in layers in such a manner that a projection structure is embedded in the insulating resinand a method for manufacturing the circuit device. In this circuit device, connection reliability be...

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Bibliographic Details
Main Authors USUI RYOSUKE, SHIBATA KIYOSHI, INOUE YASUNORI
Format Patent
LanguageChinese
English
Published 09.06.2010
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:Disclosed are a circuit device wherein a wiring layer, an insulating resin and a circuit element are arranged in layers in such a manner that a projection structure is embedded in the insulating resinand a method for manufacturing the circuit device. In this circuit device, connection reliability between the projection structure and an electrode of the circuit element is improved. Specifically disclosed is a circuit device (10) having a structure wherein a wiring layer (20), an insulating resin layer (30) and a circuit element (40) are arranged in this order and bonded together through pressure. The wiring layer (20) has projected electrodes (22) in positions corresponding to the element electrodes (42) of the circuit element (40). The insulating resin layer (30) is made of a material which causes plastic flow when a pressure is applied thereto. The projected electrodes (22) penetrate through the insulating resin layer (30) and are electrically connected with the corresponding elementelectrodes (42).
Bibliography:Application Number: CN200680045139