Solder bump forming method and apparatus

• Main Authors: FURUNO MASAHIKO, HIRATSUKA ATSUSHI, ONOZAKI JUNICHI, SHIRAI MASARU, SAITO HIROSHI, SAKAMOTO ISAO, ANDO HARUHIKO
• Format: Patent
• Language: Chinese; English
• Published: 28.03.2012
• Subjects: BASIC ELECTRIC ELEMENTS; BLASTING; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; FURNACES; FURNACES, KILNS, OVENS, OR RETORTS IN GENERAL; HEATING; KILNS; LIGHTING; MACHINE TOOLS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; MECHANICAL ENGINEERING; METAL-WORKING NOT OTHERWISE PROVIDED FOR; OPEN SINTERING OR LIKE APPARATUS; OVENS; PERFORMING OPERATIONS; PRINTED CIRCUITS; RETORTS; SEMICONDUCTOR DEVICES; SOLDERING OR UNSOLDERING; TRANSPORTING; WEAPONS; WELDING; WORKING BY LASER BEAM

The present invention relates to an apparatus characterized by a feature that in a stage on which a substrate or a jig holding a substrate is mounted, an opening closed when the substrate or the jig is mounted is provided and the substrate or the jig is heated by blowing hot air against the lower portion of the substrate or the jig, and by a feature that a solder bump is formed on a pad electrodeby heating or reflowing a solder composition which is a mixture containing solder particles, a flux component, and a liquid material which is liquid at normal temperature or changing to liquid when heated, and the composition is heated from the substrate side. With the former feature, oxidization of the solder paste on the substrate where no hot air comes and adhesion of particles to the substrate can be prevented, and with the latter feature, solder particles near the pad electrode are melted earlier and wet and spread over the pad electrode, solder particles above and far from the pad electrode are not melted suffic