AlGaN/GaN HEMT multilayer field plate device of concave grid groove and manufacturing method thereof
The invention relates to the technical field of microwave power device in semiconductor materials, discloses a AlGaN/GaN HEMT multilayer field board device of recessed grid, and meanwhile discloses a method for manufacturing AlGaN/GaN HEMT multilayer field board device of the recessed grid; on the b...
Saved in:
Main Authors | , , |
---|---|
Format | Patent |
Language | Chinese English |
Published |
01.10.2008
|
Subjects | |
Online Access | Get full text |
Cover
Loading…
Summary: | The invention relates to the technical field of microwave power device in semiconductor materials, discloses a AlGaN/GaN HEMT multilayer field board device of recessed grid, and meanwhile discloses a method for manufacturing AlGaN/GaN HEMT multilayer field board device of the recessed grid; on the basis of common AlGaN/GaN HEMT device manufacturing process, the method comprises the steps of photo-etching grid images after forming Ohm contact of a source electrode and a drain electrode, etching AlGaN extension layer of a part of the grid image, after evaporating grid metal, firstly manufacturing a grid connection field board and then a source connection field board to form the AlGaN/GaN HEMT multilayer field board device of the recessed grid. Utilization of the invention can efficiently improve puncturing characteristic, transconductance and threshold value voltage of the AlGaN/GaN HEMT device, and at the same time of improving the device plus, availably suppress phenomenon of current collapse of the AlGaN/GaN |
---|---|
Bibliography: | Application Number: CN2007164863 |