Test connection method for integrated circuit open circuit/ short-circuit

The invention relates to a connection testing method for open circuit/short circuit of an integrated circuit, and a device thereof. The method comprises the following steps: designing a double-facedprinted circuit board (1) or an insulating board (6), wherein the specification of pin pitches among c...

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Bibliographic Details
Main Authors DUAN CHAOYI, TAO SHAN, WANG GUOHUA
Format Patent
LanguageChinese
English
Published 26.01.2011
Subjects
MEASURING
MEASURING ELECTRIC VARIABLES
MEASURING MAGNETIC VARIABLES
PHYSICS
TESTING
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Summary:The invention relates to a connection testing method for open circuit/short circuit of an integrated circuit, and a device thereof. The method comprises the following steps: designing a double-facedprinted circuit board (1) or an insulating board (6), wherein the specification of pin pitches among conduction points on the upper and the lower faces of the bonding pad below the printed circuit board (1) or the specification of pin pitches among conduction terminals on the insulating board (6) is the same as that of the pin pitches among conduction points of a tested integrated circuit (8); and electronically connecting respectively the conduction points of the bonding pad below the printed circuit board (1) or the conduction terminals of the insulating board (6) with a receptacle/plug (3)via wires (2), wherein the receptacle/plug (3) is plugged with an open circuit/short circuit testing machine (4). The invention has the following technological effects: the printed circuit board or the insulating board is only
Bibliography:Application Number: CN2007173233