Semiconductor device and manufacturing method of the same

• Main Authors: NARISAWA YOSHIAKI, NISHIMURA TAKAO
• Format: Patent
• Language: Chinese; English
• Published: 05.09.2012
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The present invention provides a semiconductor device and manufacturing method thereof, the semiconductor device includes a wiring board; a first semiconductor element mounted on the wiring board; a second semiconductor element mounted on the first semiconductor element so that a position of the second semiconductor element is shifted relative to a position of the first semiconductor element; wherein a part of a main surface of the second semiconductor element faces the first semiconductor element; and an electrode pad provided on the main surface of the second semiconductor element is connected to a second semiconductor element connection pad of the wiring board by a connection part. According to the invention, the semiconductor device can be made very thin, and high design freedom degree of size and structure of a plurality of semiconductor chips superposed on support board such as wiring board can be held, or the semiconductor chip is not made very thin.