Light emitting device package and method for manufacturing the same

A light emitting device package capable of achieving an enhancement in light emission efficiency and a reduction in thermal resistance, is manufactured by a method including forming a mounting hole in a first substrate, forming through holes in a second substrate, forming a metal film in the through...

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Bibliographic Details
Main Authors WON YU HO, KIM GEUN HO, LEE SEUNG YEOB
Format Patent
LanguageChinese
English
Published 25.04.2012
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A light emitting device package capable of achieving an enhancement in light emission efficiency and a reduction in thermal resistance, is manufactured by a method including forming a mounting hole in a first substrate, forming through holes in a second substrate, forming a metal film in the through holes, forming at least one pair of metal layers on upper and lower surfaces of the second substrate such that the metal layers are electrically connected to the metal film, bonding the first substrate to the second substrate, and mounting at least one light emitting device in the mounting hole such that the light emitting device is electrically connected to the metal layers formed on the upper surface of the second substrate.
Bibliography:Application Number: CN200710102325