Novel bond pad structure and its manufacture method

• Main Authors: LIU I-TAI, LIN LIANGN, TSAO PEI-HAW, KIANG BILL, NIU PAO-KANG
• Format: Patent
• Language: Chinese; English
• Published: 26.05.2010
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The invention provides a bond pad structure and its manufacture method, which comprises a conductive material layer; a dielectric layer mounted above the conductive material layer; a second conductivematerial layer; a plurality of vias mounted in the dielectric layer, and connected electrically with the first conductive material layer and the second conductive material layer; and conductors mounted around the vias and disposed in the dielectric layers. The conductor provides a barrier to cracks in the dielectric layer encompassing the via array. Although cracks are able to spread relatively unhindered between the vias of the via array, they are blocked by the conductors and thus can not spread to neighboring regions of the chip or wafer. The conductor can be provided in a variety of shapes and dimensions, to suit a desired application. Additionally, due to its substantially uninterrupted length, the conductor provides added strength to the bond pad.