Positioning combined device and method of circuit board

• Main Author: YAN CHENXIANG
• Format: Patent
• Language: Chinese; English
• Published: 19.03.2008
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION; TECHNICAL SUBJECTS COVERED BY FORMER USPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS

The invention provides a positioning assembly device and method for the circuit board. The device includes a vacuum adsorption mechanism, a regulating mechanism, at least four cameras and a control table. The vacuum adsorption is provided with a vacuum adsorption platform, the adsorption platform is provided with a plurality of holes, the adsorption platform is connected with a plurality of vacuum generator for controlling adsorption and positioning of a mother board of circuit board, and the vacuum adsorption platform is provided with a through-opening. The regulating mechanism is arranged corresponding to the through-opening of the vacuum adsorption platform, and the regulating mechanism is used for regulating a sub board of the circuit board in three axial directions. Two of the cameras are arranged corresponding to the mother board of the circuit board and the other two are arranged corresponding to the sub-board of the circuit board for detecting optical points of the mother board and measuring points of