Method for separating a minute sample from a work piece

The invention pertains to a method for separating a minute sample (1) from a work piece (2). Such a method is routinely used in the semiconductor industry to obtain samples from wafers to be inspected in a TEM. It occurred to the inventor that approximately 20% of the obtained samples could not be p...

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Bibliographic Details
Main Authors VENEMA H. S, VERKLEI T. A. P, SCHAMPERS RUUD J. P. G
Format Patent
LanguageChinese
English
Published 16.11.2011
Subjects
INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES
MEASURING
PHYSICS
TESTING
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Summary:The invention pertains to a method for separating a minute sample (1) from a work piece (2). Such a method is routinely used in the semiconductor industry to obtain samples from wafers to be inspected in a TEM. It occurred to the inventor that approximately 20% of the obtained samples could not be properly finished (thinned) due to a misalignment of specimen carrier (6) and sample. It turned out that this misalignment is caused by the specimen carrier contacting the sample prior to welding. By not contacting the sample while welding, but leaving a small gap between specimen carrier and sample, this misalignment is avoided. To avoid movement of the specimen carrier during welding, due to e.g. vibration, the specimen carrier can be landed on the wafer on a position (8) close to the sample.
Bibliography:Application Number: CN200710136889