Stacked body for cof substrate, method for manufacturing such stacked body for cof substrate, and cof film carrier tape formed by using such stacked body for cof substrate

• Main Author: KISHIDA KATSUYA,SHIMADA AKIRA,TOKUDA YUICHI,TAKARABE TAEKO
• Format: Patent
• Language: English
• Published: 21.11.2007
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES

A stacked body which permits wiring of a driver IC chip to be recognized through an insulating layer, has strong adhesion between a conductor and the insulating layer and excellent electromigration resistivity, and to which fine processing, for example, that of a pitch of 30 m or less, can be performed, and a method for manufacturing such stacked body. The stacked body for COF substrate is provided with the insulating layer composed of an insulating resin on one plane of the conductor composed of a conductive metal foil. In the stacked body, the conductor thickness is 1-8 m, the surface roughness Rz of a plane touching the insulating layer of the conductor is 1.0 m or less, and the surface roughness Rz of a plane not touching the insulating layer of the conductor is 1.0 m or less. In the method for manufacturing the stacked body for COF substrate, the insulating layer is formed on the one plane of the conductive metal foil, which has a thickness of at least 10 m and a surface roughness Rz of 1.0 m or less on the one plane, a plane of the conductive metal foil not touching the insulating layer is chemically polished to have a conductive metal foil thickness of 1-8 m and a surface roughness Rz of 1.0 m or less to form the conductor.