Method and composition providing desirable characteristics between a mold and a polymerizable composition

The present invention provides compositions that feature improved preferential adhesion and release characteristics with respect to a substrate and a mold having imprinting material disposed therebetween. To that end, the compositions facilitate bifurcation of the imprinting into a surfactant-compon...

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Bibliographic Details
Main Author XU FRANK Y.,FLETCHER EDWARD B.,TRUSKETT VAN N.,MILLER MICHAEL N
Format Patent
LanguageEnglish
Published 24.10.2007
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Summary:The present invention provides compositions that feature improved preferential adhesion and release characteristics with respect to a substrate and a mold having imprinting material disposed therebetween. To that end, the compositions facilitate bifurcation of the imprinting into a surfactant-component-rich sub-portion and a surfactant-component-depleted sub-portion located between said surfactant-component-rich sub-portion and said substrate. This surfactant-component-rich sub-portion attenuates the adhesion forces between the mold and the imprinting material, once solidified.
Bibliography:Application Number: CN200580039772