Base plate with buried passive element and its producing method
The disclosed base plate includes interlaid circuit board of possessing first conducting circuit, dielectric layer, first electrode, second electrode, and second conducting circuit. Being setup on the interlaid circuit board, the dielectric layer possesses first concave hole and second concave hole....
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| Main Author | |
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| Format | Patent |
| Language | English |
| Published |
10.10.2007
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| Subjects | |
| Online Access | Get full text |
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| Abstract | The disclosed base plate includes interlaid circuit board of possessing first conducting circuit, dielectric layer, first electrode, second electrode, and second conducting circuit. Being setup on the interlaid circuit board, the dielectric layer possesses first concave hole and second concave hole. First electrode is setup in the first concave hole, and the second electrode is setup in the second concave hole. The first and second electrodes as well as the dielectric layer located between first electrode and second electrode constitute an embedded passive element jointly. Second conducting circuit connects first electrode and second electrode electrically. |
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| AbstractList | The disclosed base plate includes interlaid circuit board of possessing first conducting circuit, dielectric layer, first electrode, second electrode, and second conducting circuit. Being setup on the interlaid circuit board, the dielectric layer possesses first concave hole and second concave hole. First electrode is setup in the first concave hole, and the second electrode is setup in the second concave hole. The first and second electrodes as well as the dielectric layer located between first electrode and second electrode constitute an embedded passive element jointly. Second conducting circuit connects first electrode and second electrode electrically. |
| Author | YONGHUI,OU WANG |
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| Notes | Application Number: CN20071104964 |
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| PublicationCentury | 2000 |
| PublicationDate | 20071010 |
| PublicationDateYYYYMMDD | 2007-10-10 |
| PublicationDate_xml | – month: 10 year: 2007 text: 20071010 day: 10 |
| PublicationDecade | 2000 |
| PublicationYear | 2007 |
| RelatedCompanies | RIYUAGUANG SEMICONDUCTORS MANUFACTURE CO., LTD |
| RelatedCompanies_xml | – name: RIYUAGUANG SEMICONDUCTORS MANUFACTURE CO., LTD |
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| Snippet | The disclosed base plate includes interlaid circuit board of possessing first conducting circuit, dielectric layer, first electrode, second electrode, and... |
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| SubjectTerms | BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES |
| Title | Base plate with buried passive element and its producing method |
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