Base plate with buried passive element and its producing method

The disclosed base plate includes interlaid circuit board of possessing first conducting circuit, dielectric layer, first electrode, second electrode, and second conducting circuit. Being setup on the interlaid circuit board, the dielectric layer possesses first concave hole and second concave hole....

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Bibliographic Details
Main Author YONGHUI,OU WANG
Format Patent
LanguageEnglish
Published 10.10.2007
Subjects
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
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Summary:The disclosed base plate includes interlaid circuit board of possessing first conducting circuit, dielectric layer, first electrode, second electrode, and second conducting circuit. Being setup on the interlaid circuit board, the dielectric layer possesses first concave hole and second concave hole. First electrode is setup in the first concave hole, and the second electrode is setup in the second concave hole. The first and second electrodes as well as the dielectric layer located between first electrode and second electrode constitute an embedded passive element jointly. Second conducting circuit connects first electrode and second electrode electrically.
Bibliography:Application Number: CN20071104964