Semiconductor integrated circuit device

A semiconductor integrated circuit device comprising: a semiconductor chip having a plurality of surface electrodes; a plurality of leads located around said semiconductor chip, each of said plurality of leads having a first surface and a second surface opposing to said first surface and a plating l...

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Bibliographic Details
Main Author MIYAKI YOSHINORI,SUZUKI HIROMICHI,KANEDA TSUYOSHI
Format Patent
LanguageEnglish
Published 08.08.2007
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A semiconductor integrated circuit device comprising: a semiconductor chip having a plurality of surface electrodes; a plurality of leads located around said semiconductor chip, each of said plurality of leads having a first surface and a second surface opposing to said first surface and a plating layer selectively formed on said first surface of each of said plurality of leads, said plating layer providing an area for a wire bonding connection; and a plurality of bonding wires electrically connecting said plurality of surface electrodes of said semiconductor chip with said plurality of leads, respectively, such that one end of each of said plurality of bonding wires is contacted to said plating layer of a corresponding lead of said plurality of leads; and a resin body sealing said semiconductor chip, said plurality of bonding wires and said plurality of leads including said plating layer, wherein said plating layer is comprised of palladium. Therefor, it can effectively prevent a wire disconnection generated due to an increase of calorie applied to a semiconductor integrated circuit device.
Bibliography:Application Number: CN200610103047