Chip bench of plasma reinforced thin film deposition device

• Main Author: JUNFANG,FU CHEN
• Format: Patent
• Language: English
• Published: 08.08.2007
• Subjects: CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION

The invention discloses a substrate table in the reinforced plasma depositing film device, which comprises the following parts: sealed hollow disc, fixed support, heating pipe and temperature sensor, wherein the sealed hollow disc is connected by substrate board, lateral board, chassis and insulated ceramic; the fixed support is composed of metal housing, RF antenna and fixed flannel; the heating pipe is jacketed by heat tungsten wire in the metal heating sleeve. The substrate heats itself evenly and control temperature, which changes internal stress of film and microcosmic structure to reach different filming biased condition.