High-density circuit module

The present invention stacks chip scale-packaged integrated circuits CSPs into modules that conserve board surface area. In a two-high CSP stack or module 10 devised in accordance with a preferred embodiment of the present invention, a pair of CSPs 12, 14 is stacked, with one CSP 12 above the other...

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Bibliographic Details
Main Authors ROPER DAVID L, BUCHLE JEFF, CADY JAMES W, RAPPORT RUSSELL, WEHRLY JAMES DOUGLAS, WILDER JAMES
Format Patent
LanguageChinese
English
Published 17.03.2010
Subjects
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
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Summary:The present invention stacks chip scale-packaged integrated circuits CSPs into modules that conserve board surface area. In a two-high CSP stack or module 10 devised in accordance with a preferred embodiment of the present invention, a pair of CSPs 12, 14 is stacked, with one CSP 12 above the other 14. The two CSPs are connected with a pair of flexible circuit structures 30, 32. Each of the pair of flexible circuit structures 30, 32 is partially wrapped about a respective opposite lateral edge 20, 22 of the lower CSP 14 of the module 10. The flex circuit pair 30, 32 connects the upper and lower CSPs 12, 14 and provides a thermal and electrical path connection path between the module 10 and an application environment such as a printed wiring board PWB. The present invention may be employedto advantage in numerous configurations and combinations of CSPs in modules provided for high-density memories or high capacity computing.
Bibliography:Application Number: CN200810009614