High-density circuit module
The present invention stacks chip scale-packaged integrated circuits CSPs into modules that conserve board surface area. In a two-high CSP stack or module 10 devised in accordance with a preferred embodiment of the present invention, a pair of CSPs 12, 14 is stacked, with one CSP 12 above the other...
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Main Authors | , , , , , |
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Format | Patent |
Language | Chinese English |
Published |
17.03.2010
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Subjects | |
Online Access | Get full text |
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Summary: | The present invention stacks chip scale-packaged integrated circuits CSPs into modules that conserve board surface area. In a two-high CSP stack or module 10 devised in accordance with a preferred embodiment of the present invention, a pair of CSPs 12, 14 is stacked, with one CSP 12 above the other 14. The two CSPs are connected with a pair of flexible circuit structures 30, 32. Each of the pair of flexible circuit structures 30, 32 is partially wrapped about a respective opposite lateral edge 20, 22 of the lower CSP 14 of the module 10. The flex circuit pair 30, 32 connects the upper and lower CSPs 12, 14 and provides a thermal and electrical path connection path between the module 10 and an application environment such as a printed wiring board PWB. The present invention may be employedto advantage in numerous configurations and combinations of CSPs in modules provided for high-density memories or high capacity computing. |
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Bibliography: | Application Number: CN200810009614 |