Optoelectronic element encapsulation structure with temperature compensation

The invention discloses a photoelectric element packaging structure with temperature compensation, which comprises a substrate, a first light emission element arranged on the substrate, a second lightemission element, a photo-sensitive element and a driving element. In an embodiment, the first light...

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Bibliographic Details
Main Author YOU WENPING
Format Patent
LanguageChinese
English
Published 24.02.2010
Subjects
BASIC ELECTRIC ELEMENTS
DEVICES USING STIMULATED EMISSION
ELECTRICITY
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Summary:The invention discloses a photoelectric element packaging structure with temperature compensation, which comprises a substrate, a first light emission element arranged on the substrate, a second lightemission element, a photo-sensitive element and a driving element. In an embodiment, the first light emission element, the second light emission element, the photo-sensitive element and the driving element can be provided with an inner space formed by a first shell and joined together with a second shell. In another embodiment, the second light emission element and the photo-sensitive element arepositioned in the inner space of a third shell. The first light emission element and the second light emission element emit light by being driven by the driving element. The photo-sensitive element arranged adjacent to a second position is used for sensing the light emission strength of the second light emission element. Therefore, the second light emission element is arranged to ensure that thephoto-sensitive element can
Bibliography:Application Number: CN2007197735