Printing paste for offsetting electrode step difference and manufacturing method of electronic components
A production method of an electronic device comprising the steps of forming a stacked body by stacking green sheets 10a and electrode layers 12a having a predetermined pattern and firing the stacked body. Before forming the stacked body, a blank pattern layer 24 having substantially the same thickne...
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Main Authors | , , |
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Format | Patent |
Language | Chinese English |
Published |
15.07.2009
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Subjects | |
Online Access | Get full text |
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Summary: | A production method of an electronic device comprising the steps of forming a stacked body by stacking green sheets 10a and electrode layers 12a having a predetermined pattern and firing the stacked body. Before forming the stacked body, a blank pattern layer 24 having substantially the same thickness as that of the electrode layer is formed on a space portion of the electrode layer having a predetermined pattern. The electrode level difference absorbing print paste for forming the blank pattern layer 24 includes at least ceramic powder and a binder resin, and a polymerization degree of the binder resin included in the electrode level difference absorbing print paste is made equal to or more than that of a binder resin included in slurry for forming the green sheet. The binder resin of the electrode level difference absorbing print paste includes a polyvinyl butyral resin, a polymerization degree of the polyvinyl butyral resin is 1400 or more, a butyralation degree is 64 to 74 mol%, and an acetalization degre |
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Bibliography: | Application Number: CN200480015050 |