Seamless model and method of making a seamless model

The present disclosure relates to a seamless model free of bond lines made by a method which includes the steps of providing a substructure having an exposed outer surface, applying a modeling paste to the outer surface of the substructure in the form of a continuous layer, curing the continuous lay...

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Bibliographic Details
Main Authors BROAD RICHARD MARTIN, WOMBWELL PAUL TERRENCE, BADCOCK WILLIAM WALTER CHARLES, KOTNIS MAHESH ARVIND, OTLOSKI ELIZABETH LOUISE
Format Patent
LanguageChinese
English
Published 27.08.2008
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Summary:The present disclosure relates to a seamless model free of bond lines made by a method which includes the steps of providing a substructure having an exposed outer surface, applying a modeling paste to the outer surface of the substructure in the form of a continuous layer, curing the continuous layer of applied modeling paste, and machining said cured layer of modeling paste to the desired contour to form the seamless model. The modeling paste may be a mechanically frothed syntactic foam prepared by injecting inert gas with mechanical stirring into either a formed froth-forming polyurethane or epoxy composition containing microballoons.
Bibliography:Application Number: CN20018018735