Seamless model and method of making a seamless model
The present disclosure relates to a seamless model free of bond lines made by a method which includes the steps of providing a substructure having an exposed outer surface, applying a modeling paste to the outer surface of the substructure in the form of a continuous layer, curing the continuous lay...
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Main Authors | , , , , |
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Format | Patent |
Language | Chinese English |
Published |
27.08.2008
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Subjects | |
Online Access | Get full text |
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Summary: | The present disclosure relates to a seamless model free of bond lines made by a method which includes the steps of providing a substructure having an exposed outer surface, applying a modeling paste to the outer surface of the substructure in the form of a continuous layer, curing the continuous layer of applied modeling paste, and machining said cured layer of modeling paste to the desired contour to form the seamless model. The modeling paste may be a mechanically frothed syntactic foam prepared by injecting inert gas with mechanical stirring into either a formed froth-forming polyurethane or epoxy composition containing microballoons. |
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Bibliography: | Application Number: CN20018018735 |