Structure of chip resistor of low internal impedance in conductive layer

Structure of chip resistor is as follows. One pair of first surface conductive layer is formed on the base plate. A resistance layer is formed on the base plate and surface of the first surface conductive layer. Two ends of the resistance layer are electric connected to the first surface conductive...

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Bibliographic Details
Main Authors ZHEN WENJUN, XU SONGHONG, ZHOU DONGYI
Format Patent
LanguageChinese
English
Published 13.08.2008
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRICITY
RESISTORS
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Summary:Structure of chip resistor is as follows. One pair of first surface conductive layer is formed on the base plate. A resistance layer is formed on the base plate and surface of the first surface conductive layer. Two ends of the resistance layer are electric connected to the first surface conductive layer respectively. Corresponding to the pair of first surface conductive layer, one pair of second surface conductive layer is formed on surface of two ends of the resistance layer and the pair of first surface conductive layer. Finally, an insulation protection covers the resistance layer and the pair of second surface conductive layer. The invention lowers internal impedance of resistance layer of the chip resistor since the second surface conductive layers and corresponding to the first surface conductive layers contact surface and basal face of two ends of the resistance layer respectively.
Bibliography:Application Number: CN200410070779