Method of manufacturing a semiconductor device including electrodes on main and reverse sides of a semiconductor chip

A method for manufacturing a semiconductor chip includes preparing a semiconductor wafer to be oriented so that a main side and reverse side of the semiconductor wafer is oriented similar to a main side and reverse side of the semiconductor chip intended to be cut from the semiconductor wafer. An el...

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Bibliographic Details
Main Authors HIRANO NAOHIKO, MIURA SHOJI, NIIMI AKIHIRO
Format Patent
LanguageChinese
English
Published 02.04.2008
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A method for manufacturing a semiconductor chip includes preparing a semiconductor wafer to be oriented so that a main side and reverse side of the semiconductor wafer is oriented similar to a main side and reverse side of the semiconductor chip intended to be cut from the semiconductor wafer. An electrode is formed on a reverse side of the semiconductor wafer. Another electrode is formed on the main side of the semiconductor wafer while the reverse side of the wafer is fixed to a supporting substrate. The semiconductor wafer is cut later to form the semiconductor chip.
Bibliography:Application Number: CN200510006371