Bonding pad structure

A substrate has a bonding region and a sensing region. A first dielectric layer is formed overlying the substrate and has a dielectric island surrounded by a ring-shaped trench. A first conductive layer is formed in the ring-shaped trench of the first dielectric layer. A passivation layer is formed...

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Bibliographic Details
Main Author MENGQI,HOU HONG
Format Patent
LanguageEnglish
Published 29.08.2007
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A substrate has a bonding region and a sensing region. A first dielectric layer is formed overlying the substrate and has a dielectric island surrounded by a ring-shaped trench. A first conductive layer is formed in the ring-shaped trench of the first dielectric layer. A passivation layer is formed overlying the first dielectric layer and has an opening, in which the opening corresponds to the bonding region and the sensing region and exposes the dielectric island and a part of the first conductive layer. A second conductive layer covers the opening of the passivation layer and is electrically connected to the first conductive layer.
Bibliography:Application Number: CN200410050014