Method of soldering semiconductor components

A novel method of soldering semiconductor components is disclosed, in which a semiconductor component having an aluminium layer is exposed to a fluorine-containing plasma for at least one hour. The aluminium layers treated in this way can then be wetted excellently by the standard soft solders.

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Bibliographic Details
Main Author GOBRECHT, JENS
Format Patent
LanguageEnglish
German
Published 31.08.1987
Edition4
Subjects
BASIC ELECTRIC ELEMENTS
CLADDING OR PLATING BY SOLDERING OR WELDING
CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MACHINE TOOLS
METAL-WORKING NOT OTHERWISE PROVIDED FOR
PERFORMING OPERATIONS
SEMICONDUCTOR DEVICES
SOLDERING OR UNSOLDERING
TRANSPORTING
WELDING
WORKING BY LASER BEAM
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Summary:A novel method of soldering semiconductor components is disclosed, in which a semiconductor component having an aluminium layer is exposed to a fluorine-containing plasma for at least one hour. The aluminium layers treated in this way can then be wetted excellently by the standard soft solders.
Bibliography:Application Number: CH19830006811