METHOD AND DEVICE FOR PLANNING WALL SURFACE POLISHING PATH, APPARATUS AND MEDIUM

• Main Authors: SHU, YUAN, CHEN, HANGYING, LIU, MOULIN, ZHANG, TONGXIN, CAO, GUO, YUAN, HAONAN, HE, SUYUN, TAO, ZHICHENG
• Format: Patent
• Language: English; French
• Published: 20.10.2021
• Subjects: DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS; GRINDING; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; PERFORMING OPERATIONS; POLISHING; TRANSPORTING

A method including obtaining protruding points of a wall surface to be polished, and dividing the wall surface to be polished into at least two regions; determining a candidate protruding point in the next region of the region where a current protruding point is located; comparing, if the region where the current protruding point is located includes an untraversed protruding point, a first distance between the untraversed protruding point and the current protruding point, with a second distance between the candidate protruding point and the current protruding point; determining the protruding point corresponding to a minimum distance in the first distance and the second distance as a next operation point of the current protruding point; determining the wall surface polishing path based on the current protruding point and the next operation point of the current protruding point.