DEPOSITION METHODOLOGY FOR SUPERCONDUCTOR INTERCONNECTS

• Main Authors: RENNIE, MICHAEL, LUU, VIVIEN M, KIRBY, CHRISTOPHER F, MCLAUGHLIN, SEAN R
• Format: Patent
• Language: English; French
• Published: 21.02.2019
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

A method of forming a superconductor interconnect structure is disclosed. The method includes forming a dielectric layer overlying a substrate, forming an interconnect opening in the dielectric layer, and moving the substrate to a deposition chamber. The method further includes depositing a supercon...