SPUTTERING ARRANGEMENT AND SPUTTERING METHOD FOR OPTIMIZED DISTRIBUTION OF THE ENERGY FLOW

• Main Authors: LENDI, DANIEL, KRASSNITZER, SIEGFRIED, KURAPOV, DENIS
• Format: Patent
• Language: English; French
• Published: 23.01.2024
• Subjects: BASIC ELECTRIC ELEMENTS; CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS; ELECTRICITY; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION

The invention relates to a sputtering arrangement, a vacuum coating plant, and a method for carrying out high power impulse magnetron sputtering processes. The sputtering arrangement features at least two different connecting possibilities, and by switching to the second connecting possibility wherein two sputtering sub-assemblies are operated simultaneously at high power impulses, the productivity is increased. L'invention concerne un système de pulvérisation cathodique, une installation de dépôt sous vide et une méthode permettant la mise en oeuvre de techniques de dépôt par pulvérisation cathodique magnétron à impulsions haute puissance (HiPIMS), le système de pulvérisation cathodique offrant au moins deux possibilités de montage différentes, un gain de productivité pouvant être obtenu lorsque l'on passe à la deuxième possibilité de montage qui permet le fonctionnement simultané de deux sous-systèmes de pulvérisation cathodique en régime d'impulsions de haute puissance.