SEMICONDUCTOR PACKAGE WITH EMBEDDED DIE AND MANUFACTURING METHOD THEREOF

A die can be mounted on an already made pattern. Thereafter, substrate and other metal layers can be provided so as to embed the die in the substrate. This avoids the need to form a cavity in the substrate for die placement prevalent in conventional die embedding processes. As a result, die embeddin...

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Bibliographic Details
Main Authors WE, HONG BOK, ZANG, RUEY KAE, NA, JONGCHIL
Format Patent
LanguageEnglish
French
Published 23.03.2017
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A die can be mounted on an already made pattern. Thereafter, substrate and other metal layers can be provided so as to embed the die in the substrate. This avoids the need to form a cavity in the substrate for die placement prevalent in conventional die embedding processes. As a result, die embedding process can be simplified. Also, die misalignment can be reduced or eliminated.
Bibliography:Application Number: CA20162995607