DIELECTRIC MATERIAL WITH ENHANCED BREAKDOWN STRENGTH

An enhanced breakdown strength dielectric material comprises a base dielectric layer having first and second opposing major surfaces. A first stress mitigating layer is disposed on the first major surface of the base dielectric layer. A second stress mitigating layer disposed on the second major sur...

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Bibliographic Details
Main Authors SOMASIRI, NANAYAKKARA L. D, FISHER, CARL E, HUYNH, PAUL V, BIYIKLI, LEVENT, LOTTES, ANDREW C, TAYLOR, WILLIAM L
Format Patent
LanguageEnglish
French
Published 21.04.2016
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Summary:An enhanced breakdown strength dielectric material comprises a base dielectric layer having first and second opposing major surfaces. A first stress mitigating layer is disposed on the first major surface of the base dielectric layer. A second stress mitigating layer disposed on the second major surface of the base dielectric layer. A volume conductivity of at least one of the first and second stress mitigating layers is at least 2 times a volume conductivity of the base dielectric layer.
Bibliography:Application Number: CA20152964573