ELECTRONIC DEVICE ASSEMBLY

An electronic device assembly includes a heat sink coupled to an electronic device to dissipate the heat produced by the electronic device. A heat spreader is coupled between the electronic device and the heat sink to transfer heat from the electronic device to the heat sink. Furthermore, at least o...

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Main Authors HODEN, BRIAN PATRICK, JOHNSON, JAMES NEIL, KIRK, GRAHAM CHARLES, CHAUHAN, SHAKTI SINGH
Format Patent
LanguageEnglish
French
Published 07.03.2023
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:An electronic device assembly includes a heat sink coupled to an electronic device to dissipate the heat produced by the electronic device. A heat spreader is coupled between the electronic device and the heat sink to transfer heat from the electronic device to the heat sink. Furthermore, at least one of the electronic device, the heat spreader, and the heat sink is disposed with a disordered carbon coating. Un assemblage de dispositif électronique comprend un dissipateur de chaleur raccordé à un dispositif électronique pour dissiper la chaleur produite par le dispositif. Un dissipateur thermique est raccordé entre le dispositif électronique et le dissipateur de chaleur pour transférer la chaleur du dispositif électronique au dissipateur de chaleur. De plus, au moins un du dispositif électronique, du dissipateur thermique et du dissipateur de chaleur présente un revêtement de carbone désordonné.
Bibliography:Application Number: CA20152896928