METHOD AND APPARATUS FOR SKY-LINE POTTING

The present disclosure is directed to a method for potting an electrical module. In one embodiment, the method includes placing the electrical component in a potting mold, wherein the potting mold comprises an interior topology that matches a topology of one or more components of the electrical modu...

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Bibliographic Details
Main Authors HEBBORN, KEVIN A, LEIB, WILLIAM S., III, JENKINS, KENNETH, WEIMER, DAVID
Format Patent
LanguageEnglish
French
Published 06.09.2013
Subjects
AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PERFORMING OPERATIONS
PRINTED CIRCUITS
SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR
SHAPING OR JOINING OF PLASTICS
TRANSPORTING
WORKING OF PLASTICS
WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Summary:The present disclosure is directed to a method for potting an electrical module. In one embodiment, the method includes placing the electrical component in a potting mold, wherein the potting mold comprises an interior topology that matches a topology of one or more components of the electrical module, filling the potting mold with a potting compound and curing the potting compound over the electrical module.
Bibliography:Application Number: CA20132865945