LOW TEMPERATURE VIBRATION DAMPING PRESSURE SENSITIVE ADHESIVES AND CONSTRUCTIONS

This disclosure relates to viscoelastic damping materials and constructions which may demonstrate low temperature performance and adhesion and which may be used in making vibration damping composites. Viscoelastic damping materials and constructions may include polymers or copolymers of monomers acc...

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Bibliographic Details
Main Authors TRAN, THU-VAN T, WEIKEL, ARLIN L, LEWANDOWSKI, KEVIN M, GRIES, DAVID A, RENNINGER, DANIEL J, CLAPPER, JASON D
Format Patent
LanguageEnglish
French
Published 04.07.2013
Subjects
ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE
ADHESIVES
CHEMISTRY
COMPOSITIONS BASED THEREON
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
DYES
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL
ORGANIC MACROMOLECULAR COMPOUNDS
PAINTS
POLISHES
THEIR PREPARATION OR CHEMICAL WORKING-UP
USE OF MATERIALS AS ADHESIVES
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Summary:This disclosure relates to viscoelastic damping materials and constructions which may demonstrate low temperature performance and adhesion and which may be used in making vibration damping composites. Viscoelastic damping materials and constructions may include polymers or copolymers of monomers according to formula I: CH2=CHR1-COOR2 [I] wherein R1 is H, CH3 or CH2CH3 and R2 is a branched alkyl group containing 12 to 32 carbon atoms.
Bibliography:Application Number: CA20122862323