INSULATION FORMULATIONS

A curable epoxy resin formulation composition useful as insulation for an electrical apparatus including (a) at least one divinylarene dioxide; (b) at least one epoxy resin different from the divinylarene dioxide of component (a); (c) at least one anhydride hardener; (d) at least one filler; and (e)...

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Bibliographic Details
Main Authors HARRIS, WILLIAM J, ESSEGHIR, MOHAMED
Format Patent
LanguageEnglish
French
Published 22.11.2012
Subjects
BASIC ELECTRIC ELEMENTS
CABLES
CHEMISTRY
COMPOSITIONS BASED THEREON
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
CONDUCTORS
ELECTRICITY
INSULATORS
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES
THEIR PREPARATION OR CHEMICAL WORKING-UP
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Summary:A curable epoxy resin formulation composition useful as insulation for an electrical apparatus including (a) at least one divinylarene dioxide; (b) at least one epoxy resin different from the divinylarene dioxide of component (a); (c) at least one anhydride hardener; (d) at least one filler; and (e) at least one cure catalyst; wherein the epoxy resin formulation composition upon curing provides a cured product with a requisite balance of electrical, mechanical, and thermal properties such as Tg, tensile strength, dielectric strength, and volume resistivity such that the cured product can be used in applications operated at a temperature of greater than or equal to 100°C.
Bibliography:Application Number: CA20122835651