METHOD AND PRODUCT FOR CUTTING MATERIALS

The present disclosure relates to a wire and a method of forming a wire including an iron based glass forming alloy including iron present in the range of 43.0 to 68.0 atomic percent, boron present in the range of 12.0 to 19.0 atomic percent, nickel present in the range of 15.0 to 17.0 atomic percen...

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Bibliographic Details
Main Authors BRANAGAN, DANIEL JAMES, PARATORE, DAVID
Format Patent
LanguageEnglish
French
Published 12.08.2010
Subjects
ALLOYS
BROACHING
CHEMISTRY
DRESSING OR CONDITIONING OF ABRADING SURFACES
FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
FERROUS OR NON-FERROUS ALLOYS
FILING
GRINDING
LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOTOTHERWISE PROVIDED FOR
MACHINE TOOLS
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
METAL-WORKING NOT OTHERWISE PROVIDED FOR
METALLURGY
PERFORMING OPERATIONS
PLANING
POLISHING
SAWING
SCRAPING
SHEARING
SLOTTING
TRANSPORTING
TREATMENT OF ALLOYS OR NON-FERROUS METALS
WORKING CEMENT, CLAY, OR STONE
WORKING STONE OR STONE-LIKE MATERIALS
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Summary:The present disclosure relates to a wire and a method of forming a wire including an iron based glass forming alloy including iron present in the range of 43.0 to 68.0 atomic percent, boron present in the range of 12.0 to 19.0 atomic percent, nickel present in the range of 15.0 to 17.0 atomic percent, cobalt present in the range of 2.0 to 21.0 atomic percent, optionally carbon present in the range of 0.1 to 6.0 atomic percent and optionally silicon present in the range of 0.4 to 4.0 atomic percent, wherein said wire has a thickness of 140 µm or less and wherein said wire includes spinodal glass matrix microconstituents. The wire may be used in abrading a substrate.
Bibliography:Application Number: CA20102751456